We Get Breakthrough in the Back Passivation Technology

With the continuous effort of our research and development group, the wafer minor carrier lifetime of the passivation technology proceeded in our PECVD equipment has been increased 5 times on the base of traditional process, which proves that our back coating passivation technology has been mature. Furthermore, this progress fills the blank of the back coating passivation technology of the domestic equipments.　　

The back coating passivation technology is the process technology of different film formation formed on the back of wafer, this process has always monopolized by German Roth&Rau Coating Equipment and Centrotherm Coating Equipment. During the exploring time, our research and development group did plenty of document research and did DOE experiment on different passivation layers process. Finally, we realize the stead minor carrier and repeat lift. And it is the same with document record; this breakthrough fully proves that this technology of our horizontal PECVD has come to international level. It is the mark of the technology improvement of our equipment manufacturing level and it also bring some warmth in photovoltaic industry.