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全自动硅片上料机


设备名称 Equipment Name
全自动硅片上料机  Automatic Wafer Loader

设备型号 Equipment Model
ZP-Ⅲ/LSP-Ⅱ

设备用途 Equipment Application

ZP-Ⅲ :
将堆叠的硅片自动装入片篮中,并将片篮自动送入下一道工序使用。
Load the stacked wafers into cassette and transport the cassette to next process step automatically.

LSP-Ⅱ:
将片篮中的硅片自动装载到5道/8道/10道在线链式清洗设备中。
Load the wafers in the cassette to the 5-lane/8-lane/10-lane inline cleaning equipment automatically.

技术特点  Features

ZP-III

· 采用PLC控制,上片过程全自动完成;触摸屏菜单操作,简单明了。
  With PLC control and the loading process is completed automatically; Touch-screen operation, which is easy and clear.

· 装片采⽤双工位模式,提⾼了工作效率。
  With double workstations improve the working efficiency.

· 具有双片检测、上料位有无硅片检测、片盒定位检测等功能。
  With overlapping detection, loading station with/ without wafer detection, cassette positioning and monitoring fuction etc.

· 在线式/离线式可选。
  Inline/Offline optional.

· 匹配AGV, RFID,MES 管理功能。
  Compatible with AGV, RFID, MES function.

LSP-II

· 采用PLC控制,上片过程全自动完成,触摸屏菜单操作,简单明了。
  With PLC control and the loading process is completed automatically,Touch-screen operation, which is easy and clear.

· 采用单道上片方式,保证上片生产率,同时满⾜硅片按批次生产的要求。
  With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

· 采用双工位操作换片篮不停机。
  Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

· 可对硅片进入下片机前进行破片检测和破片处理。(此功能客户需另外订购,标准机无此功能)。
  Wafer breakage detection and broken wafer treatment before transfering to the unloader (need extra charges, standard equipment without this configuration).

· 匹配AGV,RFID,MES管理功能。
  Compatible with AGV, RFID, MES function. 

设备参数  Parameters