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全自动硅片下料机

设备简介  Equipment Description   

设备名称:全自动硅片下料机
Equipment Name: Automatic Wafer Unloader

设备型号:DP-Ⅲ/LXP-Ⅲ
Equipment Model: DP-III/LXP-III

设备用途:

DP-Ⅲ:将上⼀道工序片篮中的硅片自动装入下⼀道工序片篮中。

LXP-Ⅲ:将5道/8道/10道在线链式清洗设备中生产的硅片导入片篮。

Equipment Application: 

DP-III:Transfer wafers from the cassette of the previous process to the cassette of next process.

LXP-III:Unloading the wafers from the 5/8/10-lane inline cleaning equipment to cassettes.

 

技术特点  Features

DP-III

· 采用PLC控制,下片过程全自动完成;触摸屏菜单操作,简单明了。
  With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

· 采用单道下片方式,保证下片生产率,同时满足硅片按批次⽣产的要求。
  With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

· 采用双工位操作换片篮不停机。
  Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

· 在线式/离线式可选。
  Inline/Offline optional.

· 匹配AGV, RFID, MES 管理功能。 
 
 Compatible with AGV, RFID, MES function optional.LXP-III

· 采⽤PLC控制,下片过程全自动完成;触摸屏菜单操作,简单明了。
  With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

· 可对硅片进入下片机前进行破片检测和破片处理。(此功能需另外订购,标准机无此功能)
  Breakage detection and treatment before wafer unload to the unloader. (Extra charges )

· 翻转功能,称重测试功能(此功能需另外订购,标准机无此功能)。
  Wafer turnover function, Weight testing function (need extra charges, standard equipment without this configuration)

· 匹配AGV,RFID,MES管理功能。
  Compatible with AGV,RFID, MES management function.

设备参数  Parameters