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全自动硅片上料机

设备名称 Equipment Name

全自动硅片上料机  Automatic Wafer Loader


设备型号 Equipment Model

ZP-Ⅲ/LSP-Ⅱ

设备用途 Equipment Application

ZP-Ⅲ :
将堆叠的硅片自动装入片篮中,并将片篮自动送入下一道工序使用。
Load the stacked wafers into cassette and transport the cassette to next process step automatically.

LSP-Ⅱ:
将片篮中的硅片自动装载到5道/8道/10道在线链式清洗设备中。
Load the wafers in the cassette to the 5-lane/8-lane/10-lane inline cleaning equipment automatically.


技术特点  Features

ZP-III

1. 采用PLC控制,上片过程全自动完成;触摸屏菜单操作,简单明了。
With PLC control and the loading process is completed automatically; Touch-screen operation, which is easy and clear.

2. 装片采用双工位模式,提高了工作效率。
With double workstations improve the working efficiency.

3. 具有双片检测、上料位有无硅片检测、片盒定位检测等功能。
With overlapping detection, loading station with/ without wafer detection, cassette positioning and monitoring fuction etc.

4. 在线式/离线式可选。
Inline/Offline optional.

5. 匹配AGV, RFID,MES 管理功能。
Compatible with AGV, RFID, MES function.

LSP-II

1. 采用PLC控制,上片过程全自动完成,触摸屏菜单操作,简单明了。
With PLC control and the loading process is completed automatically,Touch-screen operation, which is easy and clear.

2. 采用单道上片方式,保证上片生产率,同时满⾜硅片按批次生产的要求。
With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

3. 采用双工位操作换片篮不停机。
Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

4. 可对硅片进入下片机前进行破片检测和破片处理。(此功能客户需另外订购,标准机无此功能)。
Wafer breakage detection and broken wafer treatment before transfering to the unloader (need extra charges, standard equipment without this configuration).

5. 匹配AGV,RFID,MES管理功能。
Compatible with AGV, RFID, MES function. 

设备参数  Parameters