PRODUCTS > Automatic Equipment > Automatic Wafer Handling System for DOA Equipment SYZ-Ⅲ/SYZ-IV

Automatic Wafer Handling System for DOA Equipment SYZ-Ⅲ/SYZ-IV

Equipment Name: Automatic Wafer Handling System for DOA  Equipment

Equipment Model:  SYZ-Ⅲ/SYZ-IV

Equipment Usage:  Integrated wafer loading& unloading, unloading the wafers from the quartz boat to the cassette or loading the wafers from the cassette to the quartz boat. Available for double back-to-back wafers in one slot which realize single side diffusion or available for single wafer in a slot for diffusion, annealing and oxidation process. With continuous wafer loading&unloading can guarantee the continuous  production . Or be used only for wafer loading or unloading is also available.

 

Features

SYZ-III

·Key components adopt with high quality & stability IFM sensors from Germany, which guarantees the reliability of the detection.

·Modular control program structure, highly repeatable and readable, which is convenient for function expansion in future and maintenance.

·With recipe data design which enables the equipment to work with various kinds of quartz boats with different accuracy, while running equipment will follow the boat No. automatically and retrieve the corresponding recipe data without human intervention.

·Compatible with AGV,RFID; MES function optional; Sheet resistance measurement optional.

SYZ-IV

·Throughput: 7200pcs/h.

·With IPC to running master computer software in HMI, high speed data interaction can be realized by network communication.

·With CCD industrial camera to detect dynamic location of quartz boat , which can realize deviation rectification and positioning.

·With cooling system before the unloading process, which can avoid any harmful effect on the wafers and equipment caused by high temperature.

·CCD images show the wafers condition inside the quartz boat, combine with the gripping status of each gripper can realize mis-gripping and wafer dropping detection (optional, standard equipment without this function)

·CCD images analyze the broken wafers in ceramic comb area, with dynamic cleaning unit to realize automatic broken wafers cleaning.(optional)

·Compatible with AGV,RFID; MES function optional; Sheet resistance measurement optional.

 

 

Parameters


 

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