PRODUCTS > Automatic Equipment > Automatic Wafer Unloader

Automatic Wafer Unloader

Equipment Name
Automatic Wafer Unloader

Equipment Model
DP-Ⅲ/LXP-Ⅲ

Equipment Application
DP-III:Transfer wafers from the cassette of the previous process to the cassette of next process.
LXP-III:Unloading the wafers from the 5/8/10-lane inline cleaning equipment to cassettes. 

Features

DP-III

· With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

· With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

· Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

· Inline/Offline optional.

· Compatible with AGV, RFID, MES function optional.
  




LXP-III 
· With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

· Breakage detection and treatment before wafer unload to the unloader. (Extra charges )

· Wafer turnover function, Weight testing function (need extra charges, standard equipment without this configuration)

· Compatible with AGV,RFID, MES management function.

Parameters