PRODUCTS > Automatic Equipment > Automatic Wafer Unloader DP-Ⅲ/LXP-Ⅲ

Automatic Wafer Unloader DP-Ⅲ/LXP-Ⅲ

Equipment Name:  Automatic Wafer Unloader

Equipment Model:  DP-III/LXP-III

Equipment Application: 

DP-III:Unload the cassette from the last process and load the wafers from it to the cassette of the next process automatically.

LXP-III:Unload the wafers from 5-lane or 8-lane inline cleaning equipment to cassettes.

 

Features

DP-III

·With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

·With double workstations which improves the working efficiency.

·Compatible with AGV, RFID; MES function optional.

LXP-III

·With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

·Unload wafers from single lane and adopt buffer unit,  which is easy to operate,  the equipment will not stop during cassette swap and guarantee unloading efficiency.

·Breakage detection and treatment before wafer unload to the unloader. (Extra charges )

·The wafer cassette’s baseplate can be cycled automatically. (Extra charges)

·Breakage detector;Weight testing.

·Compatible with AGV,RFID; MES management function.


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