PRODUCTS > Automatic Equipment > Automatic Wafer Loader

Automatic Wafer Loader

Equipment Name
Automatic Wafer Loader

Equipment Model
ZP-Ⅲ/LSP-Ⅱ

Equipment Application

ZP-Ⅲ :
Load the stacked wafers into cassette and transport the cassette to next process step automatically.

LSP-Ⅱ:
Load the wafers in the cassette to the 5-lane/8-lane/10-lane inline cleaning equipment automatically.

Features

ZP-III

· With PLC control and the loading process is completed automatically; Touch-screen operation, which is easy and clear.

· With double workstations improve the working efficiency.

· With overlapping detection, loading station with/ without wafer detection, cassette positioning and monitoring fuction etc.

· Inline/Offline optional.

· Compatible with AGV, RFID, MES function.

LSP-II

· With PLC control and the loading process is completed automatically,Touch-screen operation, which is easy and clear.

· With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

· Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

· Wafer breakage detection and broken wafer treatment before transfering to the unloader (need extra charges, standard equipment without this configuration).

· Compatible with AGV, RFID, MES function. 

Parameters