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Integrated PSG Removal and Edge Isolation Equipment

Equipment Name: Integrated PSG Removal and Edge Isolation Equipment

Equipment Model: SC-LSS4500CS/ SC-LSS8000CS

Equipment Application: This equipment is mainly used for etching, cleaning and drying for mono/multi-crystalline wafers.

Process Flow: Water layer protection→Single Side Edge Isolation→Alkaline cleaning→PSG Etching→Rinsing→Drying( for reference only)

 

Features

·High Throughput: 4000pcs/h, 5 lanes;  8000pcs/h, 10 lanes.

·Excellent Uniformity, long bath life time.

·Various additives or mixed additives technology.

·Wafer thickness down to 120μm.

·Quick inline bath change.

·Suitable with MES ; Inline weight inspecting is optional.

·Compatible with acid polish function.

 

  H2SO4 Free

  No Etching Edge Lines

  Fully Automatic

PID-Free(O3 Module,optional)

 

Parameters


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